Molex Releases Miniaturization Report, Highlighting Expert Insights and Innovations in Product Design Engineering and Leading-Edge Connectivity

Molex Releases Miniaturization Report, Highlighting Expert Insights and Innovations in Product Design Engineering and Leading-Edge Connectivity
  • Miniaturization impacts just about every marketplace from automotive and consumer products to details centers and clinical gadgets as much more features is squeezed into lesser areas
  • Cross-disciplinary competencies in electrical, mechanical and manufacturing engineering are essential to optimize miniaturization options and remove hurdles
  • Designers will have to ‘think big to go small’ to redefine connectivity improvements to address communications, power and I/O processing necessities

LISLE, Sick., Feb. 21, 2023 /PRNewswire/ — Molex, a international electronics chief and connectivity innovator, has introduced a new report on miniaturization in solution layout that highlights the cross-disciplinary engineering style and design and manufacturing experience needed to combine an onslaught of ever more innovative capabilities and performance into regularly shrinking device footprints. The report, “Mastering Miniaturization, Qualified Perspectives,” delivers insights on how to navigate best trade-offs when conference the price tag and house necessities of densely packaged electronics amid the increasing demand from customers for lighter, scaled-down products.

“Design engineers need to ‘think significant to go little,’ primarily when implementing substantial-pace connectors onto printed circuit boards (PCBs) reliably,” stated Brian Hauge, SVP and president, Buyer & Business Answers, Molex. “Cross-practical knowledge in electrical, mechanical and manufacturing system engineering is desired to provide microelectronic interconnects that operate at higher speeds without sacrificing extensive-time period reliability, whilst still remaining commercially viable Molex’s field-top miniaturization abilities are backed by a legacy of providing the smallest, densest and most highly developed connectivity solutions accessible right now.”

As miniaturization carries on to permeate each individual sector and application category, item designers should stability competing factors, including:

  • Energy and thermal administration
  • Sign integrity and integration
  • Element and procedure integration
  • Mechanical worry and manufacturability
  • Precision, volume production and fees

The report addresses miniaturization trends in shopper products and clinical wearables, as effectively as demand from customers for smaller, lighter electronics and connectors in automotive, knowledge middle and industrial applications. Observations from gurus across unique sectors also get rid of gentle on how miniaturization is impacting factories, info centers, vehicles, health-related wearables, smartphones, the evolution of 5G, and extra.

Miniaturization Redefines Innovation

Illustrations of new and sport-altering Molex solutions support underscore the different means that miniaturization is redefining innovation by lowering dimensions, weight and placement of elements and connectors, like:

  • Quad-Row Board-to-Board Connectors. The world’s smallest board-to-board connectors have staggered-circuit structure for 30{64d42ef84185fe650eef13e078a399812999bbd8b8ee84343ab535e62a252847} room personal savings to help smartphones, smartwatches, wearables, recreation consoles and Augmented Reality/Virtual Reality (AR/VR) products.
  • Upcoming-Generation Car or truck Architectures. Molex is driving development of zonal architectures, which exchange standard wiring harnesses with zonal gateways that team automobile functions by spot applying fewer, lesser, more highly effective and ruggedized connectors.
  • Flex-to-Board RF mmWave 5G25 Connectors. Micro-connectors blend compact size and remarkable signal integrity to supply phase-adjustments in overall performance to meet demanding 5G mmWave applications up to 25 GHz.
  • NearStack On-the-Substrate (OTS). Direct-to-chip solution places NearStack connectors immediately on the chip substrate deal, enabling high-density interconnects supporting 112 Gbps transmission around more time distances.

Molex Market place Insights

  • Kyle Glissman, world-wide product or service manager, Molex Transportation Division:
    “The capability to transfer towards .5-millimeter terminals has a compounding influence as there’s a great deal far better density to healthy extra articles and abilities in a smaller sized place.”
  • Kenji Kijima, director of mobile options, Molex Client & Professional Options:
    “With 5G, you want more antenna modules and RF functionality inside the telephone, as very well as more substantial batteries for higher electrical power, which produces tension to shrink other components.”
  • Brett Landrum, VP, Worldwide Innovation & Style, Phillips-Medisize, a Molex corporation:
    “Miniaturization is driving usability though having human-related layout to the following degree.”
  • Gus Panella, director of interconnect technologies, Molex Information Specialty Methods:
    “Applications are driving I/O density, which is stretching boundaries of the material physics for the PCB, which has led to transferring connectors onto the silicon substrate.”

About Molex
Molex is a worldwide electronics chief fully commited to producing the earth a greater, much more-related locationWith a existence in extra than 40 countries, Molex permits transformative technologies innovation in the automotive, information center, industrial automation, health care, 5G, cloud and consumer gadget industries. Via reliable shopper and sector interactions, unmatched engineering knowledge, and product or service good quality and trustworthiness, Molex realizes the infinite possible of Producing Connections for Existence. For far more facts, go to

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